【Abstract】

  Wafer defect maps exhibit spatial failure pattern recognition for root cause analysis to improve defect diagnosis resolution and yield learning conventionally. We apply further life-critically automotive electronics-driven test items to propose a wafer-level test methodology to generate a DNA-like wafer defect signature to identify wafer defects in order to approach zero-defect goals. In terms of test quality, TestDNA test sequence will be both effective and efficient, including the tight relation with traditional wafer defect patterns, number of defect types will be even more (test resolution will be higher), high prediction accuracy is expected more than 90%, and especially the non-pattern ratio will be improved to have higher defect recognition ratio.